Detailed Product Description
Specifications: 1) Item: ten layers PCB 2) Material: FR-4, FR-1, CM-1, high frequency 3) Surface finish: HAL, gold plating, fold finger, immersion silver, immersion gold, immersion tin, OSP 4) Profile: routing, punching, V-cut, chamfering 5) Mini hole: 0.2mm 6) Mini line width: 4mil (0.1mm) 7) Mini line space: 4mil (0.1mm) 8) Copper thickness: 0.5 - 6oz. 9) Special process: blind/buried hole Inner packing: Vacuum package Outer packing: Carton
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