Detailed Product Description
Specifications:
1) Item: ten layers PCB
2) Material: FR-4, FR-1, CM-1, high frequency
3) Surface finish: HAL, gold plating, fold finger, immersion silver, immersion gold, immersion tin, OSP
4) Profile: routing, punching, V-cut, chamfering
5) Mini hole: 0.2mm
6) Mini line width: 4mil (0.1mm)
7) Mini line space: 4mil (0.1mm)
8) Copper thickness: 0.5 - 6oz.
9) Special process: blind/buried hole
Inner packing:
Vacuum package
Outer packing:
Carton

