Detailed Product Description
Specifications: Board layer: 2 Material: FR-4 Min. board thickness: 0.6mm Min. line width: 0.25mm Min. line spacing: 0.18mm Min. hole diameter: 0.4mm Surface finishing: OSP / Entek / HAL Packing: Vacuum packing
Specifications: Board layer: 2 Material: FR-4 Min. board thickness: 0.6mm Min. line width: 0.25mm Min. line spacing: 0.18mm Min. hole diameter: 0.4mm Surface finishing: OSP / Entek / HAL Packing: Vacuum packing